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Rugged Electronics Packaging

Features Of Products

  • Enclosure systems are engineered to respond to our customers' performance requirements including:
  • The modularity technology means that customized enclosure solutions can be easily configured to meet customer needs.
  • Signal integrity analysis
  • Thermal analysis
  • Structural analysis
  • Conformance to various industry and military standards
  • Qualification testing
  • RoHS compliant design
  • IP65 compliant design

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Rugged Enclosures

USB Range Products

Rugged Enclosures

  • It is wonderful opportunity to share more information on this product from Hybricon corporations, through and exclusive Technology Alliance Partnership with Symmetric Technologies Pvt. Ltd.
  • Our enclosure products are designed and built using revolutionary Pac-2000® technology.
  • Superior uniform thermal performance designed-in utilizing world-class Flotherm® CFD simulation software.

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USB Range Products

1. Rack mount Air cooled Enclosure

  • Front to Rear Air Flow
  • System Monitoring
  • Air Filtering
    • Version 1: Air Filtering
    • Version 2: Air Filtering/EMI Honeycomb
  • Top Access Panel with Captive Hardware
  • Rear I/O Panel
  • Provisions to mount rugged slides
  • Forced air conduction cooled chassis
  • Rugged environments for airborne and ground
  • mobile applications
  • Extended temperature and shock & vibration tolerance
  • Military power supply for MIL-STD-704F aircraft and MIL-STD-1275 vehicle use

 


USB Range Products

2. Air Liquid cooled Enclosure

  • Brazed Construction
  • Liquid Cooled Card Cage Side Walls
  • Conduction Cooled Cards with 97W/Slot Power Dissipation
  • Custom 6 Slot VITA 41 VXS backplane with I/O Provisions
  • Top Load Modified 1ATR Short with Fiber Cover
  • MIL-STD-704A Three Phase 400 Hz AC Power
  • MIL-STD-461 EMI
  • We can customize chassis according to different form factors like cPCI, VME, SRME etc.

Deliverables :

  • User Manual
  • Design and Development of fully customized chassis
  • Custom configurations and integration services available

USB Range Products

3. Desk top / Tower chassis

a)High Power Portable Tower chassis

  • USB Interface to a host PC for set up and power
  • PCM Simulation to greater than 20 MBPS
  • Large on-board non-volatile Memory
  • Very Long Frame Capability with low frequency Dynamics
  • Complex Sub-Frame Capability
  • Super-Commutation, Sub-Commutation
  • Embedded Stream Generation
  • Sine, Square, Ramp and Step
  • Common Word Value
USB Range Products

b)Desktop enclosures

  • Description: Desktop Enclosure Solutions
  • Size: Tower; VPX REDI Designed to the latest ANSI/VITA 46.0, VITA 46.3, VITA 46.10, VITA 48.0, VITA 48.1 specifications
  • Cooling: Air Cooled Boards & Air Cooled Chassis
  • Bus Structures: cPCI, VME64X, VXS, and VPX Technologies

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Open Frame Chassis

USB Range Products

Features of Open Frame chassis

  • Support 6U Backplanes VPX,VME, cPCI
  • 6 U x 160 mm card cage with (7) 1.0” pitch positions per VITA 48.1 REDI or (9) 0.8” pitch positions per IEEE 1101.10 Open sides for debug access
  • High Performance 335 CFM Fan provides > 19 CFM per slot ATX Power Supply version: 252 CFM Fan provides >12 CFM per slot
  • Patented CoolSlot card guides improve airflow distribution across the cards
  • Fan speed control knob allows adjustment of fan speed for lower fan acoustic noise. (Note: Not available in the ATX Version)
  • Selection of Power Supplies up to 1200W
  • Smart power supply control interface
  • Front panel power LED indicators and system reset
  • Rear panel AC power switch and ESD Jack
  • 2 rear mounted power connections for external peripherals
  • Optional USB connection for remote voltage margining and current monitoring
  • Open sides and top support access by engineering and test personnel for debugging Supports 6U backplanes up to 7 slots:VPX REDI (1.0” pitch), VPX, cPCI, VME
  • VPX REDI Designed to the latest ANSI/VITA 46.0, VITA 46.3, ANSI/VITA 46.10, VITA 48.0, VITA 48.1 and OpenVPX specifications
  • 6U x 80 mm Rear Transition Modules (RTMs) per VITA 46.10 (for VPX) and IEEE 1101

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Rugged Backplanes

Features Of Rugged Backplanes

  • It is wonderful opportunity to share more information on this product from Hybricon corporations, through and exclusive Technology Alliance Partnership with Symmetric Technologies Pvt. Ltd.
  • This products support all the major bus architectures including CompactPCI, VME, VME64x, VXS, VPX, MicroTCA, switch fabrics, and custom buses.

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USB Range Products

1.Basic Subracks

  • Compliant to AUSI/VITA 46.0
  • Supports VITA 46.10 RTM connectors (optional)
  • Supports VITA 46.3 or VITA 46.4 Fabrics
  • Keying and alignment mechanism
  • Geographical Address pins
  • Reference Clock
  • Reserved for Future Use (RFU) differential pair
  • JTAG connections
  • System Management signals
  • Provides clock and data recovery from received serial PCM data over a Bit Rate range extending from 1 KBPS to greater than 10 MBPS
  • Provides data transfer to the host PC through the same USB 2 Port
  • Powered from the Host PC through the USB2 port
  • Processes all PCM Codes including RNRZ, NRZ and Bi- codes

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USB Range Products

2. 6U

  • VITA 46 VPX, 6U backplane
  • VITA 46 Mesh Technology
  • VITA 46.10 RTM connectors
  • Fabric options for VITA 46.3 or VITA 46.4
  • Utilizes high performance backplane material
  • Provisions for mechanical stops to prevent mis-insertion of payload
  • Stiffeners placed every other slot to ensure backplane rigidity
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Subracks

USB Range Products

1. Basic subracks

  • Rack mount or optional mount configurations
  • Precision-tooled extrusions
  • Provisions for rear plug-in transition modules and cabled rear transition modules
  • Available with backplanes installed (VME64x or CompactPCI®)
  • Custom hybrid versions are available
  • IEEE 1101.10/1101.11 compliant
  • Backward compatible to ANSI/IEEE 1101.1
  • Full range of sizes from 3U x 160mm to 9U x
  • 400mm with widths up to 21 slots
  • Patented CoolSlot® air deflecting card guides optimize air flow
  • Specifications

  • EXTRUSIONS: 6063-T6 Aluminum, precision grade with clear chromate (conductive) plating
  • SIDEPLATES: .090" thick aluminum, 5052-H32 with clear chromate (conductive) plating
  • CARD GUIDES: Molded plastic, Noryl N190X Black (Red for CompactPCI system slot), UL94-V0
  • TAPPED STRIPS: Carbon Steel bar stock with zinc plating and supplementary chromate treatment
  • ESD GROUND CLIP: Beryllium Copper, Alloy C17400, 1/2 HT, with Bright Tin plating / MIL-T-10727
  • OPTIONAL MOUNT (VERTICAL AND HORIZONTAL) BRACKETS: 16 gauge cold-rolled steel with zinc plating and supplemental clear chromite treatment, .125"thick aluminum, 5052-H32 with clear chromate (conductive) plating
  • INSERTER/EXTRACTOR/FIXED FRONT PANEL HANDLE: Available in VME/VXI, 1101.10 compatible, and Telecom versions
USB Range Products

2. EMI Subrack

  • Provides complete EMI/RFI containment
  • Provides quick access to the rear of the backplane
  • Rack mount or optional mount configurations
  • Precision-tooled extrusions
  • Provisions for rear plug-in transition modules and cabled rear transition modules
  • Available with backplanes installed (VME64x or CompactPCI®)
  • Custom hybrid versions are available
  • IEEE 1101.10/1101.11 compliant
  • Backward compatible to ANSI/IEEE 1101.1
  • Full range of sizes from 3U x 160mm to 9U x 400mm with widths up to 21 slots
  • Patented CoolSlot® air deflecting card guides optimize air flow
  • Specifications

  • EXTRUSIONS: 6063-T6 Aluminum, precision grade with clear chromate (conductive) plating
  • SIDEPLATES: .090" thick aluminum, 5052-H32 with clear chromate (conductive) plating
  • CARD GUIDES: Molded plastic, Noryl N190X Black (Red for CompactPCI system slot), UL94-V0
  • TAPPED STRIPS: Carbon Steel bar stock with zinc plating and supplementary chromate treatment
  • ESD GROUND CLIP: Beryllium Copper, Alloy C17400, 1/2 HT, with Bright Tin plating / MIL-T-10727
  • OPTIONAL MOUNT (VERTICAL AND HORIZONTAL) BRACKETS: 16 gauge cold-rolled steel with zinc plating and supplemental clear chromite treatment, .125"thick aluminum, 5052-H32 with clear chromate (conductive) plating
  • INSERTER/EXTRACTOR/FIXED FRONT PANEL HANDLE: Available in VME/VXI, 1101.10 compatible, and Telecom versions
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USB Range Products

Power Supply

Features Of Power Supply

  • Fully compliant with the latest CompactPCI® Specifications from PICMG®
  • Designed for telecommunications and industrial systems requiring redundancy and modularity
  • Forced current sharing and internal OR-ing diodes for N+1 redundancy
  • High current 5V and 3.3V outputs 200 Watts, 3U x 8HP
  • Universal AC input with Power Factor Correction
  • Requires only 15 CFM of external air
  • Designed to plug into Hybricon’s power plane boards
  • Voltage/Current; AC 90-264V, 3.2A max, 47-63Hz, 1 Phase; or,DC 36-72, 7.9A.
  • Fusing; Internal line fuse provided, non-user serviceable. AC- 3.15A, 250V; DC- 10.0A.
  • Power Factor; 0.99 line PFC typical at AC 115V, full load.
  • Inrush Current; Thermistor soft start. ~25ºC AC cold start current 15Apk @ AC 115V; 30Apk @ AC 230V.
  • Transient Protection; MOV. Withstands transients as specified by IEEE C62.41 3KV (differential and common mode)
  • Efficiency; 70% typical at AC 115V, full load. Redundant/Hot Swap; Full power N+1 redundant, hot swap capable.
  • Total Output Watts: Line Regulation; At the Sense Point, Over Full Input Range < ±1%, sense leads connected. Load Regulation; Output voltage droops with increasing load. Minimum Loading; 5% minimum on V1.
  • Stability; Output drift < ±0.2% after 20 minute warm-up. Temp. Coefficient; < ±0.02%/ºC, 0º to +50ºC, after 20 minute warm-up.
  • EMI Requirements: Meets IFCC Level B, and EN 55022 Level B (conducted).
  • Specifications

  • Operating Temperature: 0º to +50ºC ambient at full load, with specified airflow. Derates linearly to 50% at 70ºC. Cooling ; A minimum of 15 cfm / 400 lfm direct forward airflow required to achieve full rated power and specified MTBF. Consult factory for derating guidelines with reduced or reversed airflow.
  • Storage Temperature: • -40º to +85ºC.
  • Altitude: • Operating to 10,000 ft; Storage to 30,000 ft.
  • Humidity: • Up to 90% RH, non-condensing.
  • Shock/Vibration: • 0.75G peak, 5 – 500Hz along three orthogonal axis.
  • OTHER Specifications Mechanical: Outline ; 3U x 8HP front panel. Refer to JE Outline Dwg #02102-000 or the Mechanical Outline in this catalog. Complies with pending PICMG CompactPCI PSU specifications. Retaining Latches; Supplied with a single Rittal #3686.135 Type VII (Telecom) Lower Latch. Other manufacturers and types available. Consult factory. Guide Rails; Supplied with .260[6.61] offset guide rails use with Rittal 3687.832 (or equivalent) PSU guides. Front Panel Overlay; Supplied with Lexan overlay and JE Logo. May be deleted, or supplied with customer specified Weight; Approx: 1.8 lbs / 1.06 kgs.
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